Coming in Q2 2026
Next Gen Facility of Power Semiconductors
Why cybolution ?
*Ultra-Uniform Performance*
Single-wafer diffusion with simultaneous front- and backside heating delivers ultra-uniform thermal profiles across each wafer, cutting radial temperature gradients to below 1 °C; this tight control slashes dopant-profile variation, halves the spread of key parameters such as VBO and IG, reduces wafer bow, and boosts lot-to-lot repeatability—ultimately raising electrical yield while lowering the guard-band and test costs for high-performance thyristors and other power devices.
*One-to-One Repair Precision*
Because each wafer is processed individually in a lab-scale single-wafer reactor, engineers can tune the thermal recipe and dopant flow in real time to mirror the electrical fingerprint of the failed device, then verify the match with in-situ metrology before release. This one-at-a-time workflow eliminates cross-lot variability, avoids the queue time of batch furnaces, and lets you switch chemistries on the fly—so you get a drop-in replacement that meets the original spec within hours instead of weeks, with full traceability and virtually zero risk of over- or under-diffusion.
*Agile Pay-As-You-Go Production*
For low-volume or specialty runs, single-wafer processing converts what would be fixed batch overhead into a true pay-as-you-go model: you skip the dummy wafers, avoid tying up capital in excess inventory, and ship only the dies you’ve already sold. Because each wafer sees an identical, tightly controlled recipe, first-pass yield rises and rework falls, so the higher per-wafer process cost is offset by lower scrap and faster cash-to-cash cycles. Add in the ability to switch products within minutes—no furnace cool-down, no lot-size constraints—and you can quote premium, rapid-turn jobs that batch fabs simply can’t service profitably, capturing high-margin niche business without expanding your fixed cost base.
Why Finland ?
### Logistics & Cost Edge of a Finland-Based Lab
* *EU Internal Shipping—Zero Customs Friction*
Sitting inside the Schengen and EU Customs Union means wafers, chemicals, and finished devices cross borders without import declarations or brokerage queues, trimming 1-3 days and eliminating unpredictable duties.
* *“Next-Day Europe” Reach*
From Helsinki-Vantaa airport, nightly cargo flights and direct road links put Germany, France, Benelux, and the Nordics within 24 hours. A wafer dispatched in the evening can be back on a customer’s line the very next day.
* *Natural Gateway Between Asia and North America*
Finland’s northern air routes shorten great-circle flights; the same shift can see cargo handed off to Tokyo, Seoul, or the U.S. East Coast, minimizing transit time and temperature swings for small, high-value lots.
* *High-Frequency Ocean Links*
The ports of Helsinki and Hamina-Kotka run weekly, direct container services to Hamburg, Rotterdam, and beyond—ideal for consolidating larger equipment or chemical shipments without Baltic trans-shipment delays.
* *Low-Cost, Green Electricity—Timed for Thermal Runs*
Finland’s grid is dominated by inexpensive nuclear and renewable power. We schedule energy-intensive diffusion cycles during off-peak hours when spot prices are lowest, locking in a consistently low, predictable cost per wafer.
* *AI-Driven Automation = Higher Throughput, Lower Price*
End-to-end automation and AI-based scheduling/control squeeze every minute out of tool time, push first-pass yield up, and compress cycle times. The productivity gain flows straight into a more competitive unit price.
* *Rock-Solid Infrastructure and Cold-Chain Handling*
Finland’s power grid, roads, and heated terminals rank among the world’s most reliable, cutting insurance premiums and risk for temperature-sensitive semiconductor cargo.
* *GMT+2 Time Zone—Overlap with Both Hemispheres*
Engineers in Helsinki can talk to suppliers in Taiwan in the morning and customers in California in the afternoon, resolving technical issues in one business day instead of two.